Flight Control Areas

ESD Protection Requirements from FAA-STD-019e

Have you been tasked with specifying or installing static control flooring in a flight control area?

There are several considerations:

Will the floor meet FAA-STD-019e? Click here for a full pdf copy of this important standard.
Can the floor be grounded?
Will the floor inhibit static on people wearing standard footwear?
Which Staticworx floors can be used in FAA flight control areas?

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ESD Protection Requirements from FAA-STD-019e

August 9, 2002
DEPARTMENT OF TRANSPORTATION
FEDERAL AVIATION ADMINISTRATION STANDARD
LIGHTNING AND SURGE PROTECTION,
GROUNDING, BONDING AND SHIELDING
REQUIREMENTS FOR FACILITIES AND
ELECTRONIC EQUIPMENT

3.16.2 ESD Protection Requirements.
All NAS electrical and electronic equipment, subassemblies, and components subject to damage
from exposure to electrostatic fields or electrostatic discharge (ESD) shall be protected in
accordance with the protection requirements herein. ESD controlled areas shall be provided for
all operations, storage, repair, and maintenance spaces used for electrical and electronic
equipment or subassemblies that are subject to damage from static electricity or ESD.

3.16.3 Circuit and Equipment Design.
3.16.3.1 Circuit Design and Layout.
The design, layout, and packaging of assemblies, circuits, and components integrated into
electrical and electronic equipment shall incorporate methods and techniques to reduce
susceptibility to ESD
3.16.3.2 Component Protection.
Integrated circuits, discrete components, and other parts without internal ESD protection that are
inherently susceptible to ESD and have exposed conductive paths shall be externally protected
by a capacitor, SAS, or a varistor. Protective components shall be installed as close as possible
to the ESD susceptible item.
3.16.3.3 ESD Withstand Requirements.
In the installed and operational configuration, all equipment cabinets, enclosures, racks,
controls, meters, displays, test points, interfaces, etc, shall withstand a static discharge of 15,000
volts per ESD Associatio n Standard Test Method ESD-STM 5.1, Electrostatic Discharge
Sensitivity Testing – Human Body Model (HBM). To successfully pass HBM testing
requirements, equipment that is tested shall not suffer any operational upset or damage to any
component or assembly.
3.16.4 Classification of Materials.
3.16.4.1 General
Most materials and products that are used to control and prevent ESD are made of conductive or
static dissipative materials that are classified by their resistive properties. Antistatic materials are
an exception to this and are classified by their propensity to generate static electricity from
triboelectric charging. Any material used for construction of ESD protected areas (with the
exception of antistatic materials) shall meet the resistive properties specified for type and use of
the material. Materials that will tribocharge to greater than +/- 200 volts (EIA-625), if the
material were to contact and separate from itself or from other materials, shall not be used in
ESD controlled areas.
3.16.4.2 Conductive Materials.
Those materials with a surface resistance (Rtt) less than 1.0 x 105 ohms per ANSI/EOS/ESD
S11.1 shall be considered to be conductive. Conductive ESD control materials may create an
electrical shock hazard if used near energized equipment and shall not be used for ESD control
worksurfaces, table top mats, floor mats, flooring, or carpeting where personnel may come in
contact with energized electrical or electronic equipment. Conductive ESD control materials are
not to be used in any other application where their use could result in EMI or RFI that would be
created by rapid, high voltage ESD spark discharges. Any exceptions to this guidance shall be
through the OPI of this document.
3.16.4.3 Electrostatic Shielding Materials.
Electrostatic shielding materials are a subset of conductive materials with a surface resistance
equal to or less than 1.0 x 103 ohms (ANSI/EOS/ESD S 11.11). Electrostatic shielding materials
may be used as barriers for protection of ESD sensitive items from electrostatic fields where
required.
3.16.4.4 Electromagnetic Shielding Materials.
Electromagnetic shielding materials with highly conductive surfaces (< 10 ohms) or specifically
designed composite materials that absorb and reflect electromagnetic radiation over a broad
range of frequencie s may also be used as barriers where required to protect ESD sensitive items
from electromagnetic fields.
3.16.4.5 Static Dissipative Materials.
Those materials with a surface resistance greater than 1.0 x 105 ohms but less than or equal to
1.0 x 1012 ohms (ANSI/EOS/ESD-S11.11) are classified as static dissipative materials. Static
dissipative materials with a surface resistance less than or equal to 1.0 x 109 ohms shall be used
to provide controlled bleed-off of accumulated static charges in ESD controlled areas. Static
dissipative materials with a surface resistance of greater than 1.0 x 109 ohms but less than 1 x
1012 ohms shall not be used for applications where controlled bleed-off of accumulated static
charges is essential. Any exception to this guidance shall be through the OPI of this document.
3.16.4.6 Antistatic Materials.
Any material that inhibits or has a low propensity to generate static electricity from triboelectric
charging shall be considered antistatic. Antistatic ESD control items and materials used for
construction of ESD controlled areas in new or renovated facilities shall not tribocharge to
greater than +/- 200 volts when being used for their intended application. Antistatic materials
with a surface resistance greater than 1 x 109 ohms shall not be used for ESD protective work
surfaces, tabletop mats, floor mats, flooring, and carpeting when charge dissipation is the
primary consideration. If the surface resistance (Rtt) of an antistatic material is greater than 1012
ohms it shall normally be considered to be too resistive for use in ESD controlled areas. Use of
antistatic items and materials that utilize hygroscopic surfactants that depend on ambient
humidity to promote absorption of water shall be limited. Only antistatic materials that are
intrinsically antistatic and will retain their antistatic properties shall be used in ESD controlled
areas. Exceptions to this guidance shall be through the OPI of this document. However, if
controlled charge bleed-off is not a primary consideratio n, an antistatic material with a surface
resistivity below 1.0 x 1012 ohms or volume resistivity less than 1.0 x 1011 ohm-cm can be used
to inhibit triboelectric charging.
3.16.4.7 Static-Generative Materials, Non-Conductors™ , and Insulators
Materials having a surface resistance greater than 1.0 x 1012 ohms (ANSI/EOS/ESD-S 11.11)
shall be considered to be insulators and a possible source of triboelectric charging. These
include common plastics, Plexiglas, Styrofoam, Teflon, nylon, rubber, untreated polyethylene,
and polyurethane. Their use shall be minimized where ESD sensitive items are located.
3.16.5 Protection of ESD Susceptible and Sensitive Items
3.16.5.1 Static Protected Zone
A static protected zone shall be a volume or area where unprotected ESD sensitive items will be
protected from direct contact with electrostatic potentials greater than +/- 200 volts, electrostatic
fields greater than 100 volts/meter, or radiated electromagnetic interference (EMI) and radio
frequency interference (RFI) produced by rapid, high vo ltage ESD spark discharges. Static
protected zones shall be incorporated into the construction of ESD special protection areas, ESD
protected workstations, and ESD protected storage areas.
3.16.5.2 ESD Special Protection Areas.
Special protection areas shall be designated areas that require extraordinary ESD control
measures to accomplish the following: minimize triboelectric charging; control bleed-off and
dissipation of accumulated static charges; neutralize charges; and minimize the effects of EFields,
H-Fields, and EMI and RFI from ESD spark discharges. Areas within a facility that shall
be designated as ESD special protection areas are: air traffic operations areas (e.g., tower cab,
TRACON, ARTCC control rooms, AFSS, etc.); electronic equipment rooms; storage areas for
ESD susceptible components, subassemblies, circuit cards, etc.; and areas that contain personal
computers and Local Area Networks (LANs) that are connected to or interface directly with
NAS electronic equipment. All other locations where jacks, plug in connectors or interfaces of
ESD sensitive electronic equipment are exposed and vulnerable to damage from ESD by direct
human contact shall also be designated as ESD special protection areas.
3.16.5.2.1 ESD Controls Required for ESD Special Protection Are as.
The following minimum ESD control measures shall be implemented in all areas designated as
ESD special protection areas:
3.16.5.2.1.1 ESD Groundable Point (GP).
Each ESD control material, surface, or item used in an ESD controlled area shall have a
designated groundable point (GP) to provide ease of connection to a common groundable point.
The common groundable point (GP) shall be designated as ESD Common Point Ground or ESD
ground. The common groundable point shall accommodate electrical connections from the
groundable points of all elements of the ESD control system in the area served and shall also be
connected to the nearest multipoint ground.
3.16.5.2.1.2 Grounded Static Dissipative Surfaces.
All work surfaces which includes work surface laminates, paints and sealers, writing surfaces,
table tops, consoles, and table top mats shall be static dissipative and connected to a common
ground point (e.g., ESD common point ground or ESD ground) or directly to the multipoint
grounding system in the area served. The point-to-point resistance and surface to ground
resistance of static dissipative work surfaces shall be greater than 1.0 x 106 ohms and less than
1.0 x 109 ohms (ESD-STM 4.1, for the Protection of Electrostatic Discharge Susceptible Items -
Worksurfaces - Resistive Characterization).
3.16.5.2.1.3 Limiting the Use of Non-ESD Control Materials.
Materials that will tribocharge (e.g., generate electrostatic potentials by contact and separation
with themselves or other materials) shall not be used for construction in ESD special protection
areas. Insulative materials and any other non-essential triboelectric charge generators that
generate potentials in excess of +/- 200 volts shall not be permitted within 24” of ESD special
protection areas.

3.16.5.2.1.4 Static Dissipative Chairs.
Chairs (e.g., seating) provided for ESD special protection areas shall incorporate a continuous
path between all chair elements (e.g., cushion and arm rests) to the ground point of greater than
1.0 x 104 ohms to less than 1.0 x 109 ohms. The ground point for ESD chairs shall be
considered to be the static dissipative or conductive casters that provide electrical continuity
from all elements of the chair to an ESD control floor (e.g., ESD control carpeting, tile, or floor
mats) that is properly bonded to an appropriate ESD ground. ESD control chairs must be tested
and meet the requirements of ESD Association Standard Test Method, ESD STM 12.1, Seating -
Resistive Measurement.
3.16.5.2.1.5 Static Dissipative ESD Control Floor Coverings.
Static dissipative ESD control floor coverings shall include static dissipative tile, carpeting, static
limiting floor finishes, and floor mats. Floor coverings in ESD special protection areas shall
have a point-to-point resistance and surface-to-ground resistance of greater than 2.5 x 104 ohms
and less than 1.0 x 109 ohms (ANSI/ESD-S7.1, Resistive Characterization of Materials - Floor
Materials). These floor coverings shall be bonded to a ground point (e.g., ESD common point
ground) or directly to the multipoint grounding system in the area served in accordance with
paragraph 3.16.5.2.1.1.
3.16.5.2.1.6 Relative Humidity Control.
Relative humidity in ESD special protection areas shall be maintained within the range of 40 –
60%.
3.16.5.3 ESD Signs, Labels, Cautions, and Warnings.
ESD warning signs that include ESD sensitive device warning symbols with appropriate cautions
and warnings shall be posted in ESD special protection areas and all other ESD controlled areas.
Exterior cabinets of ESD sensitive electronic equipment shall also be marked or labeled with an
ESD sensitive device symbol with a warning that is visible from at least 3 feet from the
equipment.
3.16.5.4 ESD Protected Workstations.
In addition to the ESD controls specified in paragraph 3.16.3.2 through paragraph 3.16.3.3 the
following shall apply to all ESD protected workstations.
3.16.5.4.1 ESD Protected Workstation Minimum Requirements
All ESD control items at an ESD protected workstations shall be connected to a common
groundable point (e.g., ESD common point ground) that is connected to the multipoint grounding
system in the area served. ESD protected workstations shall provide a means of personnel
grounding (e.g., grounded wrist strap or conductive footwear in conjunction with ESD static
dissipative floor or mat) and shall have a grounded static dissipative work surface, grounded
static dissipative ESD control floor or mat, and be free of all non-essential static charge
generators. Storage containers that may be provided at ESD protected workstation shall provide
ESD protection and shall also be connected to the ESD ground. All outlets at ESD protected
workstations shall be protected with ground fault circuit interruption (GFCI) capability to
minimize danger to grounded personnel from electrical shock..

3.16.5.4.2 Use of Ionization.
Selective use of bench top or area ionizers may be considered at ESD protected workstations if
static generative items (e.g., insulators) are deemed essential and cannot be removed from ESD
protected workstation areas or if grounding of mobile personnel would be cumbersome or create
a safety hazard.
3.16.5.4.3 Identification of ESD Protected Workstations.
The boundaries of all ESD protected workstations shall be clearly defined. The boundaries of
ESD protected workstations shall extend a minimum of 24” beyond where ESD sensitive items
will be located and should be marked with yellow tape. ESD warning signs that are yellow with
black markings and lettering shall be posted that will be visible to anyone entering these areas.
Signs shall include an ESD sensitive electronic device warning symbol and appropriate warnings
and cautions.
3.16.5.5 ESD Protective Storage Areas.
3.16.5.5.1 Shelves, Bins, and Drawers.
Shelves, bins, and drawers shall be static dissipative and electrically continuous with the support
structure of the storage shelves, bins, or container.
3.16.5.5.2 Grounding.
The storage container metal support structure shall have a groundable point (GP) that shall be
connected to the ESD common point ground or directly to the nearest multipoint ground. The
resistance from the ground point of storage containers, shelving, cabinets, and bins used to store
ESD sensitive items to the multipoint ground system shall be less than one ohm.
3.16.5.5.3 Personnel Grounding.
Wrist straps shall be equipped with 1megaohm or greater series resistance to protect personnel.
Standard 0.157” banana jacks for personnel grounding wrist straps shall be connected to an ESD
ground point or directly to the multipoint ground of the area served. The resistance from a
banana jack to a ground point and/or to the nearest multipoint ground shall be less than one ohm.
3.16.5.5.4 Prohibited Materials in ESD Protective Storage Areas.
Static generative (e.g., insulative) materials shall not be used for construction in any areas where
ESD sensitive items will be stored. All materials that can generate potentials greater than +/-
200 volts shall be a minimum of 24” from ESD protected storage areas.
3.16.5.5.5 Resistance to ESD Ground for Shelves, Drawers, and Bins.
All surfaces and drawers of the storage media provided shall be made with static dissipative
materials and meet the requirements and be tested the same as work surfaces (ANSI/EOS/ESD S
4.1). The surface-to-surface resistance (Rtt) and surface-to-ground resistance (Rtg) from the
shelves, bins, and drawers of storage containers that will be used to store unprotected ESD
sensitive items shall be greater than 1.0 x 106 ohms and less than 1.0 x 109 ohms (ESD
Association Advisory, ESD ADV 53.1, for the Protectio n of Electrostatic Discharge Susceptible
Items - ESD Protective Workstations).

3.16.5.5.6 Identification of ESD Protective Storage Areas.
The boundaries of all ESD protective storage areas shall be clearly defined. Boundaries of ESD
protective storage areas shall extend a minimum of 24” beyond where ESD sensitive items will
be located and should be marked with yellow tape. ESD warning signs that are yellow with
black markings and lettering shall be posted that will be visible to anyone entering these areas.
Signs shall include an ESD sensitive electronic device warning symbol and appropriate warnings
and cautions.
3.16.6 Hard and Soft Grounds.
3.16.6.1 Hard Grounds.
Any item, material, or product that is a part of the ESD control system that is intentionally or
unintentionally connected directly to an ESD ground point (e.g., ESD common point ground
reference) or directly bonded to a multipoint ground shall be considered to be hard grounded.
Unless specified otherwise or justified by the OPI for this document, ESD control worksurfaces,
cabinets, flooring, carpeting, test equipment, and any other items used for ESD control shall be
hard grounded to an ESD common point ground reference as specified above.
3.16.6.2 Soft Grounds.
A soft ground is the intentional connection to ground through a series resistor that will limit
current flow to a predetermined maximum safe level if a person connected to the soft ground
were to come into direct contact with a known potential. The soft ground concept shall only be
used in personnel grounding skin contact devices such as wrist straps, leg or ankle straps,
conductive shoes, and heel or toe grounders. All other elements of the ESD control system shall
be hard grounded. Any exceptions to this guidance shall be through the OPI of this document.
The nominal resistance of the resistor used for soft grounding of personnel shall be not less than
1.0 X106 ohm unless otherwise specified by the OPI for this document.
3.16.7 ESD Control Floor and Coverings
All ESD control floors and floor coverings shall be installed, grounded, and initially tested only
by trained installers. ESD control floors and floor coverings shall be bonded to the nearest
multipoint ground at a minimum of four locations using 2” wide 26 gauge copper, copper foil,
conductive fabric grounding ribbon, or stranded wire that makes electrical contact with the
underside of the floor material or is embedded in the conductive permanent or releasable
adhesive used to lay the floor. Refer to Table III for equivalent wire sizes.
3.16.7.1 Surface Resistivity (Rtt).
Surface resistivity (Rtt - Resistance top-to-top or surface-to-surface) of ESD control floors,
carpets or floor mats shall be not be less than 2.5 x 104 ohms or more than 1.0 x 108 ohms
(ANSI/ESD S 7.1). A minimum of 5 readings at different locations on the floor surface shall be
taken and averaged together for each 500 square feet (or fraction thereof) of floor surface. These
readings shall be recorded in the Facility Reference Data File.

3.16.7.2 Resistance Surface-to-Ground.
Resistivity from the floor surface to ground (Rtg - Resistance top-to-ground) of ESD control
floors, carpets, or floor mats shall be greater than 2.5 x 104 ohms and less than 1.0 x 108 ohms
(ANSI/ESD S 7.1). A minimum of 5 readings shall be taken at different locations on the floor
surface and averaged together for each 500 square feet (or fraction thereof) of floor surface.
These readings shall be recorded in the Facility Reference Data File.
3.16.7.3 Triboelectric Charging Limitation.
ESD control floors, carpets, or floor mats shall limit and control generation and accumulation of
static charges to less than +/- 200 volts in ESD controlled areas.
3.16.7.4 Raised Floor Installation.
3.16.7.4.1 Resistance from Carpet Surface to Pedestal Understructure.
Carpet tiles that are installed on raised floor panels with conductive adhesive shall have a
maximum resistance from the carpeted surface of the raised floor to the pedestal of not less than
2.5 x 104 nor more than 1 x 108 ohms.
3.16.7.4.2 Panel to Understructure Resistance.
Panel-to- understructure (metal-to- metal) contact resistances between individual access floor
panels and the raised floor understructure shall be 10 ohms or less.
3.16.7.4.3 Carpet Tile Installation on Raised Floor Panels.
Individual carpet tiles may be installed on raised floor panels with either permanent or releasable
conductive adhesive depending on the application.
3.16.7.4.3.1 Grounding.
There shall be a minimum of 4 connections from the carpeting undersurface and conductive
adhesive to the raised floor panel understructure with 2” x 24” 26 AWG copper or copper foil
strip per 1,000 square feet of installed ESD control carpeting.
3.16.7.4.4 Carpet Tile Installation with Positioning Buttons.
Carpet tiles may be installed with four permanently attached ultrasonically welded positioning
buttons that can be inserted into positioning holes of specially designed access floor panels. The
bare panel shall be coated with electrically conductive epoxy paint that will provide a maximum
resistance of 1.0 x 103 ohms between the electrically conductive vinyl backing of the carpet tile
to the raised floor understructure when the carpeting is mated with the access floor panel. These
tiles using ultrasonically welded positioning buttons shall meet the surface to surface and surface
to pedestal resistance requirements listed in paragraphs 3.16.7.1 and 3.16.7.2.
3.16.8 ESD Protective Worksurfaces.
Static dissipative materials or electrostatic dissipative laminates shall be used to cover all
worksurfaces, consoles, workbenches, and writing surfaces in areas that contain ESD sensitive
equipment and in all areas designated as ESD special protection areas, static-safe zones, and
ESD protected areas.

3.16.8.1 Requirements for ESD Protective Worksurfaces.
Static dissipative worksurfaces shall be provided for new or upgrade facilities unless otherwise
specified. Permanent static dissipative worksurfaces shall be connected to the closest ESD
common point ground, element of the multipoint grounding system, or multipoint ground plate.
Permanent ESD protective static dissipative worksurfaces shall have a resistance of not less than
1.0 x 106 ohms point-to-point (Rtt) in accordance with ANSI/EOS/ESD-S 4.1, ESD Protective
Worksurfaces - Resistive Characterization. Permanent ESD protective worksurfaces shall have a
resistance from their surface to the groundable point (Rtg) of not less than 1.0 x 106 ohms and
not more than 1.0 x 109 ohms (ANSI/EOS/ESD-S 4.1).
3.16.8.1.1 Acceptable Worksurface Types.
ESD protective worksurfaces used in new and upgraded FAA facilities shall meet the
requirements of MIL-PRF-87893, Performance Specification, Workstation, Electrostatic
Discharge Control and MIL-W-87893, Military Specification, Workstation, Electrostatic
Discharge (ESD) Control.
3.16.8.1.2 Type I Worksurface - Hard.
Type I worksurfaces shall be constructed of rigid static dissipative materials of any color having
an average Shore D hardness in excess of 90. Two male or female 10 mm (0.395”) ground snap
(female) or stud (male) fasteners shall be installed on both corners on one of the longest sides of
the worksurface to accommodate the male or female snap or stud fastener of the common point
grounding cord. The locations of the two snaps or studs shall be 2” in from each corner.
3.16.8.1.3 Type II Worksurface - Cushioned.
Type II worksurfaces shall be constructed of cushioned static dissipative materials of any color
having an average Shore A (ATSM D2240) hardness in excess of 45 and less than 85. Two male
or female 10 mm (0.395”) ground snap (female) or stud (male) fasteners shall be installed on
both corners on one of the longest sides of the worksurface to accommodate the male or female
snap or stud fastener of the common point grounding cord. The locations of the two male or
female snaps or studs shall be 2” in from each corner. No low-density open-cell materials shall
be used for Type II worksurfaces.
3.16.8.2 Static Dissipative Laminates.
High pressure, multi- layer static dissipative laminates shall be used to cover surfaces such as
plywood, fiber board, particle board, bench tops, counter tops, and consoles in ESD controlled
areas and special protection areas. The laminate shall include a buried conductive layer to
provide for ease of grounding using a through bolted pressure type ESD grounding terminus.
Static dissipative laminates shall be applied to surfaces using conventional contact adhesives.
3.16.8.3 Grounding of Laminated Surfaces.
The maximum resistance across the surface (Rtt) of the static dissipative laminate shall be less
than 1.0 x 108 ohms and the maximum resistance from the surface of the laminate to ground
(Rtg) shall be less than 1.0 x 107 ohms (ESD-STM 4.1). A minimum of 5 measurements of each
shall be taken and averaged together. The values of the measurements and averages shall be
recorded and maintained in the Facility Master File.

3.16.9 Static Dissipative Coatings.
Permanent clear or colored coatings (e.g., paint) used in ESD controlled areas shall dissipate
static electricity. The surface resistance of static dissipative coatings shall not be less than 1.0 x
105 ohms or greater than 1.0 x 1010 ohms.

Other applications can include:
Engineering labs, government data centers (National Archives, IRS, SSA, NSA, FBI, etc.), war rooms, communications centers and military base electronics labs.

Purchasing
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